MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094096 A) filed by Qualcomm Incorporated on August 04, 2026, for Network Entity For Configuring Multiple... Read More
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094123 A) filed by Laitram, L. L. C. on August 04, 2026, for Singulation And Separation System. Invento... Read More
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094201 A) filed by Regeneron Pharmaceuticals, Inc. on August 04, 2026, for Viral Particles Retargeted To... Read More
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094213 A) filed by Vlinge Innovation Ab on August 04, 2026, for Mechanical Locking Device For Building P... Read More
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094319 A) filed by Qualcomm Incorporated on August 04, 2026, for Multiple Distrusting External Workloads... Read More
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094320 A) filed by Qualcomm Incorporated on August 04, 2026, for Device With Side-By-Side Integrated Cir... Read More
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094321 A) filed by Qualcomm Incorporated on August 04, 2026, for Mixed Criticality Non-Secure Protected ... Read More
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094322 A) filed by Qualcomm Incorporated on August 04, 2026, for Device Comprising A Heat Dissipation De... Read More
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094323 A) filed by Qualcomm Incorporated on August 04, 2026, for Write Data Path For High-Speed Time-Sha... Read More
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094324 A) filed by Qualcomm Incorporated on August 04, 2026, for Single Hybrid System-On-Chip (soc) Die ... Read More